SPE-11-8-092/A
05-Sep-11
Page 17 of 18
10.0 Recommended Reflow Temperature Profile
1. Time shown in the above figures is measured from the point when chip surface
reaches temperature.
2. Temperature difference in high temperature part should be within 110癈.
3. After soldering, do not force cool, allow the parts to cool gradually.
*General attention to soldering:
螲igh soldering temperatures and long soldering times can cause leaching of the
termination, decrease in adherence strength, and the change of characteristic may
occur.
?/DIV>
For soldering, please refer to the soldering curves above. However, please keep
exposure to temperatures exceeding 200癈 to under 50 seconds.
?/DIV>
Please use a mild flux (containing less than 0.2wt% Cl). Also, if the flux is water
soluble, be sure to wash thoroughly to remove any residue from the underside of
components that could affect resistance.
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